5 Pack 2.0 mm BGA Suction Desoldering Tin Wire Copper Wick Spool Wire 0.75m

Description

5 Pack 2.0 mm BGA Suction Desoldering Tin Wire Copper Wick Spool Wire 0.75m
Description:
BGA desoldering braid with unique no-clean flux,pure oxygen-free copper wire.
Finely braided from copper wire, turn into a spool.
Allow you to easily and thoroughly remove the extra solder from components or pads on the circuit board.
Will not cause any damage to the board or remove the onboard component.
Place the desoldering wick spool wire over the solder to be removed, and then push the heated soldering iron tip onto the desoldering wick.
Widely used in the rework and repair of printed circuit boards, computers, cellphones or other electronics.
Specification:
Width: 2.0mm / 0.1"
Length: 0.75m / 2.45ft
Package Includes:
5 Pieces Copper Wick Spools
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